What are the common failures of electroplating equipment?

Electroplating equipment is widely used in modern industry for metal surface treatment, depositing metal plating on the surface of the substrate through electrolysis, which is widely used in many fields such as automobile, electronics, aviation and so on. As the complexity of the plating process increases, the faults of plating equipment also become more diverse. In order to ensure the smooth progress of production, it is very important to find and solve the common faults of electroplating equipment in time. The following is a detailed introduction to the common failures of electroplating equipment and its solutions.

First, the common faults of electroplating equipment
Plating tank current is not stable plating process, the stability of the current for the quality of the plating layer is critical. If the current in the plating tank is not stable, it may lead to uneven thickness of the plated layer, rough surface or poor adhesion and other problems.

Cause of malfunction:
Unstable or fluctuating power supply voltage.
Power supply equipment malfunction and unstable output current.
The concentration of electrolyte in the plating tank is too low or too high, resulting in uneven current density.
Poor electrode contact, resulting in poor current flow.

Solution:
Regularly check the power supply equipment to ensure that its output current is stable.
Use a voltage stabilizer or UPS device to prevent voltage fluctuations from affecting the current.
Regularly check the concentration of the electrolyte to ensure that it is within a reasonable range.
Check the electrode connections to ensure that the electrode surfaces are clean and in good contact.

Uneven thickness of plating layer The thickness of plating layer directly affects the performance and appearance quality of the product. If the thickness of the plating layer is not uniform, it may lead to poor corrosion resistance or insufficient strength of the product.

Fault reason:
Uneven current density, resulting in uneven plating layer deposition.
The plating tank temperature is too high or too low, affecting the uniformity of the plating reaction.
Insufficient stirring in the plating tank, resulting in uneven current distribution.
The position of plating items is not reasonable, some parts are affected by too much current.

Solution:
Adjust the agitation system in the plating tank to ensure even current distribution.
Keep the temperature of the plating tank within the proper range to avoid too high or too low temperature.
Rearrange the position of the plated workpieces to avoid too much or too little current in some parts.
Calibrate the current control equipment periodically to ensure even current distribution.

Plating bath temperature is too high or too low The temperature of the plating bath is a very important parameter in the plating process. If the temperature is too high or too low, the plating quality will be affected. Too high a temperature may result in a thin plating layer, while too low a temperature may result in a slow plating reaction and an uneven plating layer.

Reason for malfunction:
Malfunction of cooling system, resulting in high temperature of plating solution.
Failure of the heating system, resulting in too low a temperature of the plating solution.
Temperature control system failure, can not accurately control the plating solution temperature.

Solution:
Regularly check the cooling system and heating system to ensure their normal operation.
Calibrate the temperature control system to ensure the accuracy of temperature control.
Install temperature sensors and alarm system to deal with abnormal temperature when it occurs.

Plating solution contamination or failure Plating solution is a vital chemical solution in the plating process, and its quality directly affects the plating effect. If the plating solution is contaminated or failed, it may lead to poor adhesion of plating layer, rough surface or uneven plating layer.

Failure causes:
The plating solution has not been replaced or filtered for a long time, resulting in the accumulation of impurities.
Use of unqualified raw materials, resulting in an imbalance in the composition of the plating solution.
Incomplete reaction occurs during the plating process, resulting in excessive consumption of certain components in the plating solution.

Solution:
Regularly change and filter the plating solution to ensure its cleanliness and effectiveness.
Check the quality of raw materials to ensure that plating solutions that meet standards are used.
Regularly test the chemical composition of the plating solution and make necessary adjustments.

Electroplating equipment with contaminated or damaged electrodes Electrodes play a very important role in the electroplating process, as the current flows through the electrodes and carries out the plating reaction. If the electrode surface is contaminated or damaged, it will affect the plating effect and may even lead to plating failure.

Cause of failure:
The electrode surface has not been cleaned for a long time, resulting in the accumulation of contaminants.
The electrode material is aged or damaged, resulting in a decrease in conductivity performance.
The electrolyte concentration in the plating tank is not suitable, leading to electrode corrosion.

Solution:
Clean the electrode surface regularly to remove contaminants.
Replace aged or damaged electrodes to ensure good conductivity.
Regularly check the concentration of the electrolyte to avoid corrosion of the electrodes.